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专利名称：Thermosetting resin composition,
thermosetting resin composition solution,film forming material and their curedproduct
发明人：Hiroshi Uchida,Ritsuko Azuma申请号：US12095990申请日：20061207公开号：US08575280B2公开日：20131105
摘要：Disclosed is a thermosetting resin composition including; (A) a carboxyl group-containing polyurethane prepared by using (a) a polyisocyanate compound (b) polyolcompounds (c) a carboxyl group-containing dihydroxy compound as raw materials, (B) acuring agent, wherein the polyol compounds (b) are one or more kinds of polyolcompound(s) selected from Group (I) and one or more kinds of polyol compound(s)selected from Group (II); Group I: polycarbonate polyol, polyether polyol, polyesterpolyol, and polylactone polyol, Group II: polybutadiene polyol, polysilicone havingterminal hydroxyl groups, and such a polyol that has 18 to 72 carbon atoms and oxygenatoms present only in hydroxyl groups. The thermosetting resin composition can give aprotection film for flexible printed circuits that has excellent long-term reliability ofelectric insulation, flexibility, and low warpage from curing shrinkage, and particularly lowtackiness.
申请人：Hiroshi Uchida,Ritsuko Azuma
地址：Kawasaki JP,Kawasaki JP
国籍：JP,JP
代理机构：Sughrue Mion, PLLC
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