专利名称：PRINTED CIRCUIT ASSEMBLY发明人：NGUYEN, Tuan, D.申请号：EP98906353.0申请日：19980206公开号：EP0966868A1公开日：19991229
摘要：A printed circuit assembly comprises a module with a component secured to apad on a dielectric substrate using a tin-free metal composition. A terminal of themodule is coupled to a second printed circuit board with a solder composition of at leastapproximately 40% tin. The tin-free solder composition may comprise approximately90% lead and 10% antimony.
申请人：PULSE ENGINEERING, INC.
地址：12220 World Trade Drive San Diego, CA 92128 US
国籍：US
代理机构：Moncheny, Michel, et al
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