专利名称：Adhesive tape for electronic parts and liquid
adhesive
发明人：Yukinori Sakumoto,Takeshi
Hashimoto,Katsuji Nakaba,MasaharuKobayashi,Takeshi Nishigaya,FumiyoshiYamanashi
申请号：US08/326427申请日：19941020公开号：US05494757A公开日：19960227
摘要：This invention is to provide a liquid adhesive of the present invention can beadhered and cured at a relatively low temperature and have sufficient heat resistance andreliability, etc., and an adhesive tape using the same.
The liquid adhesive of this invention is obtainable by dissolving (a) a
piperazinylethylaminocarbonyl- containing butadiene-acrylonitrile copolymer having aweight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% byweight, and an amino equivalent of 500-10,000, represented by the following formula (I):##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175,and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups,the ratio of component (b) based on 100 parts by weight of component (a) being in therange of 10 to 900 parts by weight. This is applied to one or both surfaces of a heatresistant film or one surface of a release film to form an adhesive layer, therebyobtaining an adhesive tape for electronic parts.
申请人：TOMOEGAWA PAPER CO., LTD.
代理机构：Lowe, Price, LeBlanc & Becker
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